IEEE 1101.2 PDF

in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.

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Also similar to the embodiment of FIG. The configuration of FIG. DE DET2 en More information add to basket. Please select Ok if you would like to proceed with this request anyway. DIN EN remains valid alongside this standard until In the present invention, the wedgelock is mounted to one surface of the frame such that when installed in a conduction-cooled chassis, the opposite frame surface is forced against the chassis cold wall.

Although the wedgelock 3 would most likely be used in practice, a larger wedgelock can also be used in this alternate embodiment. Citations are based on reference standards. Would you also like to submit a review for this item? Wedge lock for use with a single board computer and method of assembling a computer system.

However, none of these patents disclose or suggest a structure that satisfies the IEEE Adapter kit for making it possible to use the extended width wedge lock in circuit card module. Please enter ieed name. Additionally, for IEEE In summary, the larger surface contact area between the frame 11 and chassis 2 cold wall as well as the additional clamping force from the larger wedgelock 13 results in overall lower component running temperatures for this embodiment.

An adapter for commercial off-the-shelf COTS circuit card modules resulting in increased cooling efficiency.

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Wedgelock device for increased thermal conductivity of a printed wiring assembly. A commercially-available wedgelock 13 suitable for use in the present invention is the Card-Lok product which can be obtained from Calmark Corp.

Conduction cooled CompactPCI boards ready for insertion

The increased force, in combination with the additional contacting surface areas, significantly reduces the thermal resistance between the frame and the chassis 2 cold wall. Certification of persons Do recognize your skills, register online to become certified.

Wedgelocks made of aluminum are preferred, although other materials can be used. In particular, the adapter frame structure of the present invention is designed to allow the use of large wedgelocks, e.

Please enter the message. The embodiments of an invention in which an exclusive property or right is claimed are defined as follows: Terms and conditions for Customized compilation of standards Contact us Accessibility. The improved cooling efficiency is achieved, at least in part, through the use of a larger wedgelock Add a review and share your thoughts with other readers.

CompactPCI on the rise! The specific requirements or preferences of your reviewing publisher, classroom teacher, institution or organization should be applied. Industrial communication networks – Fieldbus specifications – Part In fact if a system is not custom, based on a nonstandard backplane architecture, and if a 6U form factor can be used, then typically VME has been used.

The circuit card module of claim 4wherein said wedgelock has a thermal resistance per inch of wedgelock length of no greater than 1 C. The metal strip 5 acts both as a heatsink and as protection for the card 7 against damage when it is inserted and removed from the chassis 2.

It should be understood, however, that the detailed description of the invention and the ieeee examples presented, while indicating certain embodiments of the present invention, are provided for illustration purposes only because various changes and modifications within the spirit and scope of the invention will become apparent to those of skill in the art from the detailed description of the invention and claims that follow.

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Conduction-Cooled PMC (CCPMC)

For example, if the circuit card modules are integrated first tested in a commercial, convection-cooled chassis in a laboratory environment and ieeee installed into the actual chassis, then an extended width wedgelock would be used. The reduction of thermal resistances and temperature rises is reflected in a reduced running temperature for component 6.

Conventional cooling methods utilized in off-the-shelf parts include normal convection, forced convection—such as fan cooling, liquid cooling, various forms of heat conductors or sinks, etc.

The other thermal path for component 6 shown by the dotted arrow in FIG. In any event, an extended width wedgelock allows for greater surface contact keee 30 to improve the thermal performance.

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This article will examine the typical conduction cooled environment as well as some of the design issues that are involved with developing conduction cooled product. More specifically, the present invention relates generally to circuit card modules having frames that can be adapted to improve the cooling properties of the modules but optionally remain compliant with Institute of Electrical and Electronics Engineers IEEE specifications.

Option to visualize changes at a glance.